Money A2Z Web Search

Search results

1. Results From The WOW.Com Content Network

2. Wafer testing - Wikipedia

   en.wikipedia.org/wiki/Wafer_testing

   Wafer testing. Wafer testing is a step performed during semiconductor device fabrication after the back end of line (BEOL) process is finished. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test ...

3. Check valve - Wikipedia

   en.wikipedia.org/wiki/Check_valve

   Tilting-disc inconel check valve Check valve symbol on piping and instrumentation diagrams. The arrow shows the flow direction. Vertical lift check valve. A check valve, non-return valve, reflux valve, retention valve, foot valve, or one-way valve is a valve that normally allows fluid (liquid or gas) to flow through it in only one direction. [1]

4. Wafer (electronics) - Wikipedia

   en.wikipedia.org/wiki/Wafer_(electronics)

   Bottom right: completed solar wafers. In electronics, a wafer (also called a slice or substrate) [ 1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells . The wafer serves as the substrate for microelectronic devices ...

5. Wafer fabrication - Wikipedia

   en.wikipedia.org/wiki/Wafer_fabrication

   Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency ( RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.

6. Probe card - Wikipedia

   en.wikipedia.org/wiki/Probe_card

   Use and manufacture. A probe card or DUT board is a printed circuit board (PCB), and is the interface between the integrated circuit and a test head, which in turn attaches to automatic test equipment (ATE) (or "tester"). [ 2] Typically, the probe card is mechanically docked to a Wafer testing prober and electrically connected to the ATE .

7. Wafer-level packaging - Wikipedia

   en.wikipedia.org/wiki/Wafer-level_packaging

   A wafer-level package attached to a printed-circuit board. Wafer-level packaging ( WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps ...

8. Chip-scale package - Wikipedia

   en.wikipedia.org/wiki/Chip-scale_package

   A chip scale package or chip-scale package ( CSP) is a type of integrated circuit package. [ 1] Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC 's standard J-STD-012, Implementation of Flip Chip and Chip Scale ...

9. Die preparation - Wikipedia

   en.wikipedia.org/wiki/Die_preparation

   Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film upon which the wafer is mounted ...