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A swing check valve (or tilting disc check valve) is a check valve in which the disc, the movable part to block the flow, swings on a hinge or trunnion, either onto the seat to block reverse flow or off the seat to allow forward flow. The seat opening cross-section may be perpendicular to the centerline between the two ports or at an angle.
FOUP. FOUP (an acronym for Front Opening Unified Pod[ 1] or Front Opening Universal Pod[ 2]) is a specialized plastic carrier designed to hold silicon wafers securely and safely in a controlled environment, and to allow the wafers to be transferred between machines for processing or measurement. [ 3]
An early transistor socket and an integrated circuit socket are included for comparison. Tube sockets are electrical sockets into which vacuum tubes (electronic valves) can be plugged, holding them in place and providing terminals, which can be soldered into the circuit, for each of the pins. Sockets are designed to allow tubes to be inserted ...
Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the reference plane, where the reference plane is defined by three corners of an equilateral triangle [clarification needed]. This definition is based on now obsolete ASTM F534. [ 1] Warp is the difference between the maximum and the minimum ...
Wafer testing. Wafer testing is a step performed during semiconductor device fabrication after the back end of line (BEOL) process is finished. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test ...
Automatic test equipment diagnostics is the part of an ATE test that determines the faulty components. ATE tests perform two basic functions. The first is to test whether or not the Device Under Test is working correctly. The second is when the DUT is not working correctly, to diagnose the reason.
A chip scale package or chip-scale package ( CSP) is a type of integrated circuit package. [ 1] Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC 's standard J-STD-012, Implementation of Flip Chip and Chip Scale ...
A wafer-level package attached to a printed-circuit board. Wafer-level packaging ( WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps ...
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related to: how to install wafer check valve dimensions definition freeRated Excellent for Customer Service 2014 - StellaService