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  2. Check valve - Wikipedia

    en.wikipedia.org/wiki/Check_valve

    Tilting-disc inconel check valve Check valve symbol on piping and instrumentation diagrams. The arrow shows the flow direction. Vertical lift check valve. A check valve, non-return valve, reflux valve, retention valve, foot valve, or one-way valve is a valve that normally allows fluid (liquid or gas) to flow through it in only one direction. [1]

  3. Wafer testing - Wikipedia

    en.wikipedia.org/wiki/Wafer_testing

    Wafer testing. Wafer testing is a step performed during semiconductor device fabrication after the back end of line (BEOL) process is finished. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test ...

  4. Wafer (electronics) - Wikipedia

    en.wikipedia.org/wiki/Wafer_(electronics)

    Bottom right: completed solar wafers. In electronics, a wafer (also called a slice or substrate) [ 1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells . The wafer serves as the substrate for microelectronic devices ...

  5. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Semiconductor device fabrication. Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM ). It is a multiple-step photolithographic and physico-chemical process (with steps such as ...

  6. Die preparation - Wikipedia

    en.wikipedia.org/wiki/Die_preparation

    Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film upon which the wafer is mounted ...

  7. Wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Wafer-level_packaging

    A wafer-level package attached to a printed-circuit board. Wafer-level packaging ( WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps ...

  8. Automatic test equipment - Wikipedia

    en.wikipedia.org/wiki/Automatic_test_equipment

    Automatic test equipment diagnostics is the part of an ATE test that determines the faulty components. ATE tests perform two basic functions. The first is to test whether or not the Device Under Test is working correctly. The second is when the DUT is not working correctly, to diagnose the reason.

  9. Probe card - Wikipedia

    en.wikipedia.org/wiki/Probe_card

    Use and manufacture. A probe card or DUT board is a printed circuit board (PCB), and is the interface between the integrated circuit and a test head, which in turn attaches to automatic test equipment (ATE) (or "tester"). [ 2] Typically, the probe card is mechanically docked to a Wafer testing prober and electrically connected to the ATE .

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