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  2. Check valve - Wikipedia

    en.wikipedia.org/wiki/Check_valve

    A swing check valve (or tilting disc check valve) is a check valve in which the disc, the movable part to block the flow, swings on a hinge or trunnion, either onto the seat to block reverse flow or off the seat to allow forward flow. The seat opening cross-section may be perpendicular to the centerline between the two ports or at an angle.

  3. Wafer testing - Wikipedia

    en.wikipedia.org/wiki/Wafer_testing

    Wafer testing. Wafer testing is a step performed during semiconductor device fabrication after the back end of line (BEOL) process is finished. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test ...

  4. Wafer fabrication - Wikipedia

    en.wikipedia.org/wiki/Wafer_fabrication

    Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency ( RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.

  5. Flip chip - Wikipedia

    en.wikipedia.org/wiki/Flip_chip

    Flip chip. Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [ 1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.

  6. Wafer (electronics) - Wikipedia

    en.wikipedia.org/wiki/Wafer_(electronics)

    Bottom right: completed solar wafers. In electronics, a wafer (also called a slice or substrate) [ 1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells . The wafer serves as the substrate for microelectronic devices ...

  7. Wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Wafer-level_packaging

    A wafer-level package attached to a printed-circuit board. Wafer-level packaging ( WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps ...

  8. Probe card - Wikipedia

    en.wikipedia.org/wiki/Probe_card

    Use and manufacture. A probe card or DUT board is a printed circuit board (PCB), and is the interface between the integrated circuit and a test head, which in turn attaches to automatic test equipment (ATE) (or "tester"). [ 2] Typically, the probe card is mechanically docked to a Wafer testing prober and electrically connected to the ATE .

  9. Extremely rare "doomsday fish" found off California coast - AOL

    www.aol.com/extremely-rare-doomsday-fish-found...

    Kayakers and snorkelers exploring the Southern California coast spotted an extremely rare oarfish, nicknamed a "doomsday fish" since they are seen in some parts of the world as harbingers of ...

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