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A swing check valve (or tilting disc check valve) is a check valve in which the disc, the movable part to block the flow, swings on a hinge or trunnion, either onto the seat to block reverse flow or off the seat to allow forward flow. The seat opening cross-section may be perpendicular to the centerline between the two ports or at an angle.
Bottom right: completed solar wafers. In electronics, a wafer (also called a slice or substrate) [ 1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells . The wafer serves as the substrate for microelectronic devices ...
A butterfly valve is from a family of valves called quarter-turn valves. In operation, the valve is fully open or closed when the disc is rotated a quarter turn. The "butterfly" is a metal disc mounted on a rod. When the valve is closed, the disc is turned so that it completely blocks off the passageway. When the valve is fully open, the disc ...
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency ( RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.
A reduced pressure zone device ( RPZD, RPZ, or RPZ valve) is a type of backflow prevention device used to protect water supplies from contamination. RPZDs may also be known as reduced pressure principle (RP), reduced pressure principle backflow prevention devices, [ 1][ 2] reduced pressure zone assemblies (RPZA), [ 3] or reduced pressure ...
A wafer-level package attached to a printed-circuit board. Wafer-level packaging ( WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps ...
Wafer testing. Wafer testing is a step performed during semiconductor device fabrication after the back end of line (BEOL) process is finished. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test ...
The most common final control element in the process control industries is the control valve. The control valve manipulates a flowing fluid, such as gas, steam, water, or chemical compounds, to compensate for the load disturbance and keep the regulated process variable as close as possible to the desired set point. [ 1]
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related to: how to install wafer check valve dimensions explained youtubeRated Excellent for Customer Service 2014 - StellaService