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  2. Wafer fabrication - Wikipedia

    en.wikipedia.org/wiki/Wafer_fabrication

    Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency ( RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.

  3. Check valve - Wikipedia

    en.wikipedia.org/wiki/Check_valve

    A swing check valve (or tilting disc check valve) is a check valve in which the disc, the movable part to block the flow, swings on a hinge or trunnion, either onto the seat to block reverse flow or off the seat to allow forward flow. The seat opening cross-section may be perpendicular to the centerline between the two ports or at an angle.

  4. Chemical-mechanical polishing - Wikipedia

    en.wikipedia.org/wiki/Chemical-mechanical_polishing

    Chemical mechanical polishing (CMP) (also called chemical mechanical planarization) is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. [ 1] It is used in the semiconductor industry to polish semiconductor wafers as part of ...

  5. Flow coefficient - Wikipedia

    en.wikipedia.org/wiki/Flow_coefficient

    Flow coefficient. The flow coefficient of a device is a relative measure of its efficiency at allowing fluid flow. It describes the relationship between the pressure drop across an orifice valve or other assembly and the corresponding flow rate . Mathematically the flow coefficient Cv (or flow-capacity rating of valve) can be expressed as. where.

  6. Wafer testing - Wikipedia

    en.wikipedia.org/wiki/Wafer_testing

    Wafer testing. Wafer testing is a step performed during semiconductor device fabrication after the back end of line (BEOL) process is finished. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test ...

  7. Non-contact wafer testing - Wikipedia

    en.wikipedia.org/wiki/Non-contact_wafer_testing

    The wafer is lifted by the wafer prober until metal pads on one or more ICs on the wafer make physical contact with the probes. A certain amount of over-travel is required after the first probe makes contact with the wafer, for two reasons: to guarantee that all probes have made contact (to account for non-planarity of the wafer)

  8. Piping and instrumentation diagram - Wikipedia

    en.wikipedia.org/wiki/Piping_and_instrumentation...

    A piping and instrumentation diagram (P&ID) is defined as follows: A diagram which shows the interconnection of process equipment and the instrumentation used to control the process. In the process industry, a standard set of symbols is used to prepare drawings of processes. The instrument symbols used in these drawings are generally based on ...

  9. Jennifer Lopez Shares Behind-the-Scenes Look at Evening Out ...

    www.aol.com/jennifer-lopez-shares-behind-scenes...

    Jennifer Lopez is sharing a behind-the-scenes look at a recent night out.. The singer and actress, 55, celebrated the opening night of the Intuit Dome in Inglewood, California, which featured ...

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