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2. Check valve - Wikipedia

   en.wikipedia.org/wiki/Check_valve

   A swing check valve (or tilting disc check valve) is a check valve in which the disc, the movable part to block the flow, swings on a hinge or trunnion, either onto the seat to block reverse flow or off the seat to allow forward flow. The seat opening cross-section may be perpendicular to the centerline between the two ports or at an angle.

3. Wafer (electronics) - Wikipedia

   en.wikipedia.org/wiki/Wafer_(electronics)

   Bottom right: completed solar wafers. In electronics, a wafer (also called a slice or substrate) [ 1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells . The wafer serves as the substrate for microelectronic devices ...

4. Flip chip - Wikipedia

   en.wikipedia.org/wiki/Flip_chip

   Flip chip. Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [ 1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.

5. Wafer fabrication - Wikipedia

   en.wikipedia.org/wiki/Wafer_fabrication

   Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency ( RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.

6. Wafer testing - Wikipedia

   en.wikipedia.org/wiki/Wafer_testing

   Wafer testing. Wafer testing is a step performed during semiconductor device fabrication after the back end of line (BEOL) process is finished. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test ...

7. Die preparation - Wikipedia

   en.wikipedia.org/wiki/Die_preparation

   Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film upon which the wafer is mounted ...

8. Epitaxial wafer - Wikipedia

   en.wikipedia.org/wiki/Epitaxial_wafer

   An epitaxial wafer[ 1] (also called epi wafer, [ 2] epi-wafer, [ 3] or epiwafer[ 4]) is a wafer of semiconducting material made by epitaxial growth ( epitaxy) for use in photonics, microelectronics, spintronics, or photovoltaics. The epi layer may be the same material as the substrate, typically monocrystaline silicon, or it may be a silicon ...

9. Wafer-scale integration - Wikipedia

   en.wikipedia.org/wiki/Wafer-scale_integration

   Wafer-scale integration (WSI) is a system of building very-large integrated circuit (commonly called a "chip") networks from an entire silicon wafer to produce a single "super-chip". Combining large size and reduced packaging, WSI was expected to lead to dramatically reduced costs for some systems, notably massively parallel supercomputers but ...