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Plain tobacco packaging. Plain cigarette packaging, as required in Australia since 2012: the pack has an olive drab colour ( Pantone 448 C ), with the brand name printed in a standard font and size – no logo, other colour or branding allowed. Plain tobacco packaging, also known as generic, neutral, standardised or homogeneous packaging, is ...
Low-profile quad flat-package ( LQFP ): 1.4 mm high, varying sized and pins on all four sides. Plastic quad flat-pack ( PQFP ), a square with pins on all four sides, 44 or more pins. Ceramic quad flat-pack ( CQFP ): similar to PQFP. Metric quad flat-pack ( MQFP ): a QFP package with metric pin distribution.
Testing modified atmosphere in a plastic bag of carrots. Food packaging is a packaging system specifically designed for food and represents one of the most important aspects among the processes involved in the food industry, as it provides protection from chemical, biological and physical alterations. [ 1]
A Benson & Hedges pack in the United Kingdom, before the introduction of plain packaging in 2017 In 1971, tobacco companies printed on the left side of cigarette packets an official warning: "Warning by H.M. Government – Smoking can harm your health", followed by the phrase " Health Department 's Chief Medical Officers", issuers of the warning.
Semiconductor package. A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting ...
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the ...
A wafer-level package attached to a printed-circuit board. Wafer-level packaging ( WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps ...
Modified atmosphere packaging ( MAP) is the practice of modifying the composition of the internal atmosphere of a package (commonly food packages, drugs, etc.) in order to improve the shelf life. [ 1][ 2] The need for this technology for food arises from the short shelf life of food products such as meat, fish, poultry, and dairy in the ...
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