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2. Wafer (electronics) - Wikipedia

   en.wikipedia.org/wiki/Wafer_(electronics)

   In electronics, a wafer (also called a slice or substrate) [ 1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells . The wafer serves as the substrate for microelectronic devices built in and upon the wafer.

3. Wafer testing - Wikipedia

   en.wikipedia.org/wiki/Wafer_testing

   Wafer testing. Wafer testing is a step performed during semiconductor device fabrication after the back end of line (BEOL) process is finished. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test ...

4. Czochralski method - Wikipedia

   en.wikipedia.org/wiki/Czochralski_method

   Due to efficiencies of scale, the semiconductor industry often uses wafers with standardized dimensions, or common wafer specifications. Early on, boules were small, a few centimeters wide. With advanced technology, high-end device manufacturers use 200 mm and 300 mm diameter wafers.

5. Check valve - Wikipedia

   en.wikipedia.org/wiki/Check_valve

   A swing check valve (or tilting disc check valve) is a check valve in which the disc, the movable part to block the flow, swings on a hinge or trunnion, either onto the seat to block reverse flow or off the seat to allow forward flow. The seat opening cross-section may be perpendicular to the centerline between the two ports or at an angle.

6. Flow coefficient - Wikipedia

   en.wikipedia.org/wiki/Flow_coefficient

   Flow coefficient. The flow coefficient of a device is a relative measure of its efficiency at allowing fluid flow. It describes the relationship between the pressure drop across an orifice valve or other assembly and the corresponding flow rate . Mathematically the flow coefficient Cv (or flow-capacity rating of valve) can be expressed as. where.

7. Multi-project wafer service - Wikipedia

   en.wikipedia.org/wiki/Multi-project_wafer_service

   Multi-project wafer service. Multi-project chip ( MPC ), and multi-project wafer ( MPW) semiconductor manufacturing arrangements allow customers to share tooling (like mask) and microelectronics wafer fabrication cost between several designs or projects. MPC consisting of five CMOS IC designs and few test N- and PMOS transistors for ...

8. Chip-scale package - Wikipedia

   en.wikipedia.org/wiki/Chip-scale_package

   A chip scale package or chip-scale package ( CSP) is a type of integrated circuit package. [ 1] Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC 's standard J-STD-012, Implementation of Flip Chip and Chip Scale ...

9. Stepper - Wikipedia

   en.wikipedia.org/wiki/Stepper

   A stepper or wafer stepper is a device used in the manufacture of integrated circuits (ICs). It is an essential part of the process of photolithography, which creates millions of microscopic circuit elements on the surface of silicon wafers out of which chips are made. It is similar in operation to a slide projector or a photographic enlarger.