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Wafer size – largest wafer diameter that a facility is capable of processing. (Semiconductor wafers are circular.) Process technology node – size of the smallest features that the facility is capable of etching onto the wafers. Production capacity – a manufacturing facility's nameplate capacity. Generally max wafers produced per month.
Semiconductor device manufacturing has since spread from Texas and California in the 1960s to the rest of the world, including Asia, Europe, and the Middle East. Wafer size has grown over time, from 25 mm in 1960, to 50 mm in 1969, 100 mm in 1976, 125 mm in 1981, 150 mm in 1983 and 200 mm in 1992. [30] [31]
Bottom right: completed solar wafers. In electronics, a wafer (also called a slice or substrate) [ 1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells . The wafer serves as the substrate for microelectronic devices ...
Unlike fabless semiconductor companies, STMicroelectronics owns and operates its own semiconductor wafer fabs. The company owned five 8-inch (200 mm) wafer fabs and one 12-inch (300 mm) wafer fab in 2006. [citation needed] Most of the production is scaled at 0.18 μm, 0.13 μm, 90 nm and 65 nm (measurements of transistor gate length ...
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency ( RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.
Foundry processes include; Film Deposition, Metal Deposition, Thermal, Wafer Bonding, Etch processes including DRIE and VHF, Wet Processes, and Wafer Level Packaging. Silicon High volume production 8 IDM China: IMEC: Low-medium volume MEMS manufacturing (CMOS compatible), incl. custom design, development, post-processing and prototyping
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